The 44-Layer IC Probe Card
PCB is a high-precision, multi-layer printed circuit board engineered specifically for semiconductor testing applications. Designed to interface with unpackaged integrated circuits directly from the wafer, this advanced probe card ensures accurate signal transmission and reliable electrical contact during critical test phases. With its robust construction using TUC/TU872HF laminate material, it delivers exceptional thermal stability, dimensional accuracy, and signal integrity—making it an essential component in modern chip manufacturing and quality assurance processes. This product stands out due to its meticulously structured layering: L1–L44 at 10 mil thickness, L1–L28 at 12 mil, and L29–L44 at 14 mil, allowing for optimized routing of complex high-frequency signals while minimizing crosstalk and impedance mismatches. The surface finish features hard gold plating ranging from 3 to 15 microns, enhancing durability, reducing wear from repeated probing cycles, and ensuring consistent conductivity over time. Additional special processing steps such as metal cladding and depth-controlled drilling further improve mechanical strength and precision alignment with micro-scale die pads. Engineered for performance under demanding conditions, the 44-layer configuration supports intricate interconnects required by advanced IC designs like logic chips, memory devices, and system-on-chip (SoC) solutions. Its green solder mask enhances visual inspection during assembly and maintenance, while the standardized size of 20" x 22" ensures compatibility with existing automated test equipment (ATE) platforms used across global semiconductor fabrication facilities. Ideal for use in semiconductor fabs, R&D labs, and independent validation centers, this probe card enables comprehensive functional testing at scale without compromising on accuracy or repeatability. Whether validating new silicon architectures or verifying batch consistency, engineers rely on this PCB to deliver precise measurements of voltage, current, resistance, and other key parameters essential for device reliability. Users consistently praise its ability to maintain signal fidelity even under high-speed operation, thanks to controlled impedance design and superior dielectric properties of the base material. Many report reduced failure rates in final product testing after implementing this solution, attributing improved yield and earlier detection of defects during wafer-level testing. Common questions often revolve around compatibility with various ATE systems, expected lifespan under continuous operation, and ease of integration into existing production lines. While specific configurations may vary based on customer requirements, the board’s modular design and standardized dimensions make it adaptable to most industry-standard testers. With proper handling and regular calibration, users typically observe extended operational life compared to conventional probe cards. In summary, the 44-Layer IC Probe Card PCB represents a benchmark in precision testing technology—offering unmatched reliability, scalability, and performance for semiconductor manufacturers worldwide. It is not merely a tool but a strategic asset in ensuring the quality, functionality, and longevity of next-generation electronic
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Product Categories : PCB
