High-Frequency Power Amplifier
PCB – Precision Engineering for RF and Microwave Applications This high-frequency power amplifier PCB is engineered for optimal performance in demanding radio frequency (RF) and microwave environments. Designed with Taconic TC350 material, a premium laminate known for its exceptional dielectric stability and low signal loss, this 2-layer printed circuit board delivers reliable operation across a wide range of frequencies. With a finished copper thickness of 1 oz, immersion gold surface finish, and a total thickness of 1.2mm, it meets IPC6012 Class 2 quality standards—ideal for precision applications where consistency and durability are critical. Key Features: - Ultra-low insertion loss: as low as 0.0009 at 10 GHz ensures minimal signal degradation - Dielectric constant stability: ±0.02 tolerance for predictable impedance control - High adhesion strength (>10 lb/inch) between layers for mechanical reliability - Smooth rolled copper foil improves current distribution and reduces skin effect - Reverse copper skin technology enhances Passive Intermodulation (PIM) performance - Low water absorption and NASA-certified materials for aerospace-grade reliability - Flat copper surface (0.0015mm deviation) supports precise component mounting The PCB leverages advanced fabrication capabilities including minimum line width/spacing of 3 mil (0.075mm), via hole sizes down to 4 mil (0.1mm), and support for boards up to 500 x 800 mm. Whether you're building a compact 3G smart antenna, a high-efficiency power amplifier module, or a phased array radar system, this PCB provides the structural integrity and electrical performance required for next-generation wireless systems. Its compatibility with multiple Taconic substrates—from TLY-5A to RF-45—makes it adaptable for various RF design needs, from low-noise amplifiers (LNAs) to complex filters and couplers. Ideal for use in telecommunications infrastructure, satellite communications, military radar systems, GPS modules, and industrial IoT devices, this high-frequency PCB excels in environments requiring thermal stability, minimal signal distortion, and long-term operational resilience. The material’s ability to maintain consistent electrical properties under extreme conditions makes it suitable for both terrestrial and airborne platforms. Users consistently report superior signal integrity, reduced phase noise, and improved efficiency in their RF designs when using this PCB. Engineers appreciate the fast turnaround time—sample boards available in as little as 24 hours for 2-layer versions—and the consistent quality that enables rapid prototyping without compromising on performance. Common Questions: What makes this PCB ideal for high-frequency applications? Its Taconic TC350 base material offers ultra-stable dielectric characteristics, low loss tangent, and excellent dimensional accuracy—critical for maintaining signal fidelity at GHz-level frequencies. How does it handle PIM issues? By incorporating reverse copper skin and smooth rolled copper foil, the PCB minimizes nonlinear effects that cause passive intermodulation, which is essential for clean signal transmission in cellular networks. Can it be used in aerospace projects? Yes—it’s NASA-certified and built to withstand harsh environmental conditions, making it suitable for space-grade and aviation electronics. Is it compatible with other Taconic materials? Absolutely. It's part of a broader ecosystem of Taconic-based PCBs used in everything from 5G infrastructure to collision avoidance systems, offering flexibility across different project requirements.
Product Categories : PCB
