10-layer 1+N+1 HDI communication PCB

High-Density Interconnect (HDI) PCB with 10 Layers and Advanced Impedance Control for Precision Electronics

This advanced 10-layer HDI printed circuit board, structured as 1+8+1, represents a cutting-edge solution for modern communication devices demanding high performance, compact design, and reliable signal integrity. Engineered with FR4 material possessing a Tg of 170°C, it ensures thermal stability under intense operational conditions—ideal for applications in consumer electronics, portable computing, and wireless systems. The board’s overall thickness of 1.2mm supports sleek product form factors while maintaining structural robustness across diverse environments.

Featuring precision manufacturing capabilities including micro-via technology, this PCB offers minimum through-hole diameters of 0.20mm and blind vias as small as 0.10mm, enabling dense routing without compromising reliability. With line widths and spacing at 2.5/2.2 mils, it meets the stringent requirements of high-speed digital circuits. Copper layer specifications include outer layers at 35µm and inner layers at 18µm, providing optimal current-carrying capacity and minimizing resistive losses in signal paths.

The board is optimized for impedance-controlled designs, supporting critical standards such as 50Ω for antenna traces and differential pairs at 90Ω and 100Ω—essential for maintaining signal fidelity in RF and high-frequency data transmission. These features make it particularly suitable for mobile communications, embedded systems, and next-generation IoT devices where electromagnetic compatibility (EMC) and minimal crosstalk are paramount.

Designed for ultra-compact devices like smartphones, tablets, ultrabooks, e-readers, and portable gaming consoles, this HDI PCB delivers enhanced functionality within reduced physical footprints. Its use extends beyond consumer gadgets into professional domains such as medical instrumentation, aviation electronics, and industrial automation equipment—where space efficiency, durability, and electrical precision converge to meet rigorous engineering benchmarks.

Engineers and designers benefit from its versatility in creating lightweight, high-performance boards that support complex multi-layer interconnections while reducing assembly complexity. By leveraging advanced lamination techniques and precise drilling processes, this PCB enables manufacturers to achieve superior yield rates and consistent quality in mass production settings.

Users consistently report improved signal integrity, faster prototyping cycles, and better integration of BGA packages down to 0.20mm pitch—making it an ideal choice for compact, high-density assemblies. Whether deployed in smart wearables, digital cameras, or 4G-enabled modules, this PCB proves essential in delivering reliable connectivity and future-proof scalability.

Common questions often revolve around thermal management, especially when used in portable systems with limited airflow. However, the Tg170-rated substrate provides excellent heat resistance, ensuring long-term reliability even during sustained operation. Another frequent inquiry involves trace impedance consistency across multiple layers—addressed here by controlled dielectric thickness and accurate copper weight distribution throughout the stack-up.

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