10-layer 3+N+3 HDI PCB

High-Density Interconnect (HDI) PCB – 10-Layer 3+N+3 Design with Advanced Impedance Control for Next-Gen Electronics

This premium 10-layer HDI printed circuit board is engineered for high-performance applications in modern portable and compact devices. Built using a 3+N+3 layer configuration, it combines robust mechanical stability with optimized signal integrity, making it ideal for advanced consumer electronics, industrial systems, and communication hardware. With a total thickness of 1.2mm and FR4 material rated at Tg170, this PCB ensures reliable thermal performance under demanding operating conditions.

Key features include outer copper layers of 35µm and inner layers at 18µm, enabling fine pitch routing while maintaining excellent current-carrying capacity. The board supports ultra-small vias—down to 0.10mm blind holes and 0.20mm through holes—and accommodates BGA Components as small as 0.25mm, allowing for maximum component density without compromising reliability. Line width and spacing are precisely controlled at 2.8/3.2 mils, ensuring consistent signal transmission across complex layouts.

Impedance control is a standout feature, offering tailored solutions for critical signal paths: 50Ω for antenna traces, and 90Ω or 100Ω differential pairs for high-speed data interfaces such as USB 3.0, HDMI, or PCIe. These specifications make the board suitable for RF modules, wireless transceivers, and high-frequency digital circuits where signal fidelity is paramount. Whether used in mobile computing platforms or embedded IoT systems, this PCB delivers exceptional electrical performance and long-term durability.

Designed for cutting-edge applications in smartphones, tablets, ultrabooks, digital cameras, and portable gaming devices, this HDI solution enables manufacturers to reduce product footprint while enhancing functionality. Its compatibility with surface-mount technology (SMT), fine-line etching, and microvia fabrication makes it an excellent choice for designers aiming to push the boundaries of miniaturization and integration in compact electronic products.

Engineers and product developers appreciate its versatility across multiple sectors—from consumer gadgets like e-readers and GPS units to professional tools including medical imaging equipment and aerospace-grade circuitry. By leveraging advanced laminates and precise manufacturing tolerances, this PCB sets a new standard for reliability, efficiency, and scalability in modern electronics design.

Users consistently praise its ability to support intricate routing requirements while minimizing electromagnetic interference (EMI). Many report improved signal quality and reduced crosstalk compared to traditional multilayer boards, especially when deployed in high-speed digital environments. The board’s uniform copper distribution and low-loss dielectric properties contribute significantly to stable power delivery and enhanced thermal dissipation—key factors in prolonged device operation.

Common questions often revolve around suitability for high-frequency designs, ease of assembly, and long-term reliability under thermal stress. This PCB excels in all three areas due to its carefully selected materials, stringent quality controls during production, and proven track record in demanding applications worldwide. It is particularly favored by OEMs developing next-generation wearable tech, smart sensors, and compact IoT gateways where space constraints and signal integrity are equally important.

Product Categories : PCB