Rogers RO4350B High-Frequency Microwave
PCB Board – Premium RF Circuit Solution for Advanced Electronics This high-performance Rogers RO4350B microwave PCB is engineered for precision in demanding radio frequency applications. As a reliable dielectric substrate with consistent electrical properties, it supports stable signal transmission at elevated frequencies—making it ideal for modern communication systems, radar technologies, and high-speed data processing equipment. With a controlled dielectric constant of 3.48 ± 0.05 and excellent thermal stability, this board ensures minimal signal loss and superior performance under varying environmental conditions. Key Features: - Dielectric Constant (Dk): 3.48 ± 0.05 — Ensures predictable impedance control for high-frequency designs - Thickness: 0.762 mm (30 mil) dielectric layer, finished board thickness of 0.85 mm - Copper Cladding: 1 oz (35 µm) finish with half-ounce (17 µm) initial foil for uniform etching - Surface Finish: Immersion Gold – Offers excellent solderability, corrosion resistance, and long-term reliability - Layer Configuration: Dual-layer structure optimized for compact, high-density RF layouts - Material Compatibility: Seamlessly integrates with FR4, IT180, and other laminates for hybrid PCB solutions Detailed Description: The Rogers RO4350B is a thermoset laminate based on hydrocarbon ceramic technology, offering low dielectric loss and exceptional dimensional stability across temperature ranges from -55°C to +150°C. Unlike standard FR4 materials, which suffer from increased signal attenuation at GHz frequencies, RO4350B maintains consistent electrical characteristics even under high-power operation. This makes it particularly suitable for designing printed circuit boards used in satellite communications, millimeter-wave systems, automotive radar sensors, and industrial instrumentation. The material’s compatibility with both traditional and advanced manufacturing processes allows seamless integration into automated production lines without compromising quality or yield. Its ability to bond effectively with prepreg materials such as RO4350B PP enables the creation of mixed dielectric structures that combine cost-efficiency with performance—ideal for multi-layer hybrid PCBs where different layers serve distinct functional roles. Applications: Engineers and designers rely on RO4350B for applications requiring precise electromagnetic behavior, including but not limited to: - RF front-end modules in 5G base stations and mobile devices - Radar systems for automotive ADAS and aerospace navigation - Medical imaging equipment utilizing microwave energy - Industrial automation sensors operating in harsh environments - Military-grade communication hardware needing ruggedized performance - Test and measurement instruments requiring minimal phase distortion User Feedback: Customers worldwide praise the consistency and repeatability of Rogers RO4350B boards in complex RF designs. Many report significant improvements in return loss, insertion loss, and overall system efficiency when switching from conventional substrates. Users involved in prototyping and volume production alike appreciate the material’s ease of handling during lamination, drilling, and plating steps, especially when working with fine-line features and tight tolerances. Frequently Asked Questions: What makes Rogers RO4350B better than FR4 for microwave circuits? RO4350B offers lower dielectric loss tangent and more stable Dk values over frequency and temperature, making it far more suitable for high-frequency signal integrity compared to FR4. Can I use RO4350B with other materials like FR4 in the same stack-up? Yes, it’s commonly combined with FR4 in hybrid PCBs—such as RO4350B + FR4—to balance performance and cost while maintaining mechanical rigidity and thermal management benefits. How do I ensure optimal results when using this material? Follow recommended fabrication guidelines for via filling, surface finish selection, and copper thickness control. Working with experienced PCB manufacturers who specialize in high-frequency materials will maximize your design's potential. Is immersion gold the best surface treatment for RF PCBs? Immersion gold provides excellent conductivity, solder joint reliability, and protection against oxidation—critical for maintaining signal integrity in sensitive microwave circuits.
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