Low Temperature Co-fired Ceramic (LTCC)
PCB: High-Density, High-Reliability Multilayer Substrate for Advanced Electronics This advanced Low Temperature Co-fired Ceramic printed circuit board offers superior performance in high-frequency, high-speed, and high-power applications. Designed for complex three-dimensional integration of microwave and digital circuits, LTCC technology combines ceramic materials with thick-film processes to deliver unmatched reliability, thermal stability, and miniaturization capabilities. With a maximum dimension of 100 mm × 100 mm, it supports intricate layouts while maintaining precise control over line width (minimum 0.075 mm), spacing (minimum 0.15 mm), and conductor thickness (10–25 μm). Its exceptional printing accuracy (±10 μm) and stack alignment precision (≤30 μm) ensure consistent electrical performance across layers—ideal for demanding environments such as aerospace, defense, and telecommunications. Key Features: - Ultra-fine trace resolution with minimum line width of 0.075 mm and spacing of 0.15 mm - Embedded resistors (10 Ω to 10 kΩ) with surface adjustment accuracy under 1% and internal resistance tolerance within 30% - Through-hole diameter as small as 0.1 mm, enabling dense interconnects - Sintering shrinkage controlled within ±0.2%, ensuring dimensional consistency - Multi-layer capability up to 40 layers, supporting embedded passive
Components like capacitors, inductors, filters, and couplers - Excellent dielectric properties suitable for RF/microwave systems with wide bandwidth and low signal loss Detailed Description: The LTCC substrate is fabricated using multiple ceramic green sheets stacked and laminated together, each layer containing conductive patterns and via holes filled with conductive paste. These are then co-fired at relatively low temperatures (typically below 900°C), allowing the use of base metals like copper or silver without degradation. This process enables the creation of fully integrated 3D circuits where active devices can be mounted directly onto the top layer, and interconnections formed via pins or solder joints. The result is a robust, compact structure that enhances electromagnetic compatibility, reduces parasitic effects, and improves heat dissipation compared to traditional FR4 PCBs. Unlike conventional printed wiring boards, LTCC substrates offer better mechanical strength, higher thermal conductivity, and improved long-term reliability—especially critical in harsh operating conditions such as extreme temperatures, vibration, and humidity. Applications: Ideal for next-generation electronic systems requiring high-density packaging, including radar modules, satellite communication units, missile guidance systems, high-performance computing chips, medical imaging devices, and automotive electronics. Industries leveraging this technology include military/aerospace, telecom infrastructure, industrial automation, and consumer electronics with premium specifications. For example, Fujitsu’s VP2000 supercomputer utilized a 61-layer LTCC module, while NEC developed a 78-layer version with over 11,500 I/O connections—an achievement only possible through precise multilayer ceramic fabrication techniques. User Testimonials: Engineers working on advanced RF front-end designs appreciate how LTCC simplifies component integration while reducing board size by up to 50%. One user noted, “It eliminated the need for external passives and allowed us to embed resistors directly into the substrate, cutting assembly time significantly.” Another highlighted its thermal management benefits: “We were able to run our power amplifier continuously at 80°C ambient without any performance drop—something we couldn’t achieve with standard PCBs.” Frequently Asked Questions: What makes LTCC different from traditional PCBs? Unlike standard FR4-based boards, LTCC uses ceramic materials that provide superior dielectric properties, thermal conductivity, and dimensional stability—making them ideal for high-frequency and high-reliability applications. Can LTCC support high-current applications? Yes, due to its excellent thermal dissipation characteristics and the ability to incorporate thick metal layers, LTCC can handle higher current densities than conventional substrates. Is LTCC environmentally friendly? Yes, the low-temperature firing process consumes less energy and avoids hazardous materials typically found in high-temperature co-fired ceramics, aligning with global sustainability goals. How many layers can an LTCC board have? Modern manufacturing allows up to 40 or more layers, depending on design complexity and application requirements. What types of passive components can be embedded in LTCC? Capacitors, resistors, inductors, filters, and even some hybrid components can be integrated directly into the ceramic layers during fabrication, reducing overall system cost and improving performance.
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