Ceramic Substrate Pcb

DPC ceramic substrate PCB

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

DPC Ceramic Substrate for High-Performance LED Applications – Advanced Thermal Management & Durability Engineered for precision and reliability, this DPC ceramic substrate leverages advanced ceramic aluminum oxide technology to deliver superior thermal conductivity, mechanical strength, and electrical insulation....

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Low Temperature Co-fired Ceramic PCB

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

Low Temperature Co-fired Ceramic (LTCC) PCB: High-Density, High-Reliability Multilayer Substrate for Advanced Electronics This advanced Low Temperature Co-fired Ceramic printed circuit board offers superior performance in high-frequency, high-speed, and high-power applications. Designed for complex three-dimensional...

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Radar PCB & Missile range & Shooting range

• Brand: UGPCBA
• Packaging: Vacuum packing
• Min. Order: 1 Piece/Pieces
• Place of Origin: China

Radar PCB: High-Frequency Printed Circuit Board for Advanced Radar Systems Discover the precision-engineered Radar PCB, a critical component in modern radar applications such as automotive ADAS, military defense systems, and aerospace communication. Designed for high-frequency performance, this printed circuit board...

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Component Substrate PCB

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

The substrate material used in Component Substrate PCB serves as the foundational element for manufacturing semiconductor components and printed circuit boards (PCBs), playing a pivotal role in modern electronics. This high-performance ceramic-based substrate, typically composed of high-purity alumina, undergoes...

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PCB for IC package substrate

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

IC Package Substrate Solutions for Advanced Semiconductor Applications – Precision, Innovation, and Integration Overview The evolution of semiconductor packaging has driven the demand for high-performance, miniaturized, and reliable IC package substrates. As traditional lead-frame-based solutions reach their limits in...

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PCB for IC substrate

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

The Full Name and Description of LGA Package: A Revolutionary Step in Semiconductor Packaging Technology This product description explores the evolution, functionality, and future potential of Land Grid Array (LGA) packaging, particularly focusing on the LGA775 variant—a pivotal advancement in CPU interface design....

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Sensor IC Substrate

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

Shengyi SI10U Sensor IC Substrate: High-Performance, Halogen-Free Material for Advanced MEMS Applications The Shengyi SI10U Sensor IC Substrate is a premium printed circuit board material engineered specifically for micro-electro-mechanical systems (MEMS) sensors. Designed to meet the demanding requirements of modern...

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