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Basic Info
Brand: UGPCBA
Additional Info
Transportation: Air,Express
Place of Origin: China
Product Description
High-Precision Prototype PCB Assembly for Advanced Communication Devices
Engineered for excellence in electronics manufacturing, this prototype PCB assembly service delivers unmatched accuracy and reliability for communication equipment development. Whether you're prototyping a new 5G module, IoT device, or embedded system, our state-of-the-art facility ensures your printed circuit boards meet the highest standards of performance and durability. With over 50 SMT production lines and cutting-edge automation technology, we specialize in rapid turnaround, precision component placement, and comprehensive quality assurance—ideal for R&D teams, startups, and established manufacturers seeking to scale efficiently.
Our expertise lies in handling complex board designs with ultra-fine pitch Components such as BGA, QFP, CSP, and PQCC packages, down to 0201 size with ±0.04mm accuracy. This level of precision supports advanced applications like flexible PCBs, thin substrates, gold finger connectors, and TFT display driver assemblies—all critical in modern wireless communication systems. By integrating intelligent inspection tools including 3D AOI, X-RAY, SPI, ICT, and first-piece verification systems, we guarantee defect-free assemblies that pass rigorous compliance checks before shipment.
Key Features:
This service is tailored for engineers and product developers working on next-generation communication hardware, including but not limited to mobile phone motherboards, battery management units, RF modules, and smart sensor platforms. Our team leverages imported Fuji NXTIII and AIMEX pick-and-place machines alongside automated solder paste printers and multi-zone reflow ovens to ensure repeatability across prototypes and early production runs. The entire process—from design validation to final test—is optimized for speed without compromising on quality control, making it an ideal partner for agile development cycles in telecom, industrial IoT, and consumer electronics sectors.
Users consistently highlight our ability to handle challenging builds with minimal setup time and maximum yield. One client noted, “We were able to move from concept to functional prototype in just two weeks—something we couldn’t achieve with other vendors due to their lack of fine-pitch capability.” Another praised the seamless integration of automated optical inspection and rework capabilities, stating, “The consistency in mounting accuracy allowed us to reduce field failures by over 70% during beta testing.”
Frequently Asked Questions:
What makes your SMT line suitable for communication devices? Our specialized equipment and skilled technicians are trained to manage high-density boards commonly found in cellular modems, baseband processors, and antenna modules. We use nitrogen atmosphere reflow ovens and precise stencil printing techniques to prevent cold joints and bridging issues—common challenges in RF and high-frequency designs.
Can you support mixed technology assembly? Yes, we offer both surface mount and through-hole assembly, including manual insertion for components that cannot be automatically placed. This flexibility allows us to accommodate legacy parts alongside modern ICs in hybrid boards.
Do you provide documentation for compliance? Absolutely—we supply detailed assembly drawings, bill of materials (BOM), test reports, and material certificates upon request, ensuring traceability and adherence to international standards such as IPC-A-610 Class 3.
How quickly can I get my prototype back? Turnaround times vary based on complexity, but most projects are completed within 5–7 business days, with rush options available for urgent needs.
Product Categories : PCBA
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