Six-Layer Core Module
PCB Design for High-Performance Embedded Systems This advanced six-layer printed circuit board (
PCB) is engineered to support robust data integrity, precise signal routing, and reliable operation in demanding industrial and IoT environments. Designed with a focus on impedance control, length matching, and electromagnetic compatibility, this core module delivers exceptional performance for applications requiring high-speed communication, real-time processing, and stable power delivery. Key Features: - 6-layer stack-up optimized for signal integrity and noise reduction - Immersion gold surface finish for superior solderability and long-term reliability - Htg170 material, 1.6mm thickness, 1oz copper traces for thermal stability and mechanical durability - Precision 5/5mil trace width and spacing, 8mil via diameter for fine-pitch component placement - Impedance tolerance within ±10% for consistent signal transmission across critical nets - Integrated 24VDC power input supporting low-voltage logic levels - Multiple interface options: RS485 x3 for sensor integration, RJ45 x1 for Ethernet connectivity (100Mbps), and dual wireless modules (4G LTE + LoRa) enabling remote monitoring and control via MQTT protocols The heart of the system lies in its embedded CPU architecture—a central processing unit that orchestrates computation, memory access, and peripheral coordination. This core board serves as an all-in-one solution combining processor, memory, and I/O interfaces into a compact, modular format. Unlike traditional monolithic designs, this approach allows developers to decouple the core logic from application-specific backplanes, significantly accelerating prototyping cycles while enhancing system modularity and maintainability. Memory subsystems are designed for efficient data handling—integrating both volatile RAM for active processes and non-volatile storage for persistent configuration or firmware updates. The separation between main memory (on-board DRAM) and auxiliary storage ensures rapid access to runtime instructions without compromising long-term data retention. Ideal for smart lighting systems, environmental monitoring units, industrial automation controllers, and edge computing gateways, this PCB supports seamless integration of sensors, actuators, and cloud-connected devices. Whether deployed in outdoor installations requiring ruggedized
Components or indoor setups demanding minimal EMI, the design maintains signal fidelity even under challenging conditions. Users have praised the board’s ability to simplify complex hardware development while delivering enterprise-grade performance. Its standardized pinout enables easy pairing with various carrier boards, making it ideal for OEMs seeking scalable solutions across multiple product lines. Frequently Asked Questions: What makes this PCB suitable for industrial use? Its combination of immersion gold finish, rigid substrate material, and strict impedance control ensures durability and consistent signal quality in harsh environments. How does the 6-layer design improve performance compared to 4-layer boards? Additional layers allow better routing separation between power, ground, and high-speed signals, reducing crosstalk and improving overall electromagnetic compatibility (EMC). Can I customize the layout for specific I/O requirements? Yes, the modular nature of the core board allows for flexible customization through compatible backplane designs tailored to your unique application needs. Is the board compatible with standard embedded Linux distributions? Absolutely—it supports common operating systems such as Yocto, Debian, and Ubuntu, facilitating rapid software development and deployment.
Product Categories : PCB Design
