Ic Substrate

BGA IC Substrate Board

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

Advanced IC Substrate PCB for High-Density Packaging Solutions Engineered for next-generation semiconductor packaging, this cutting-edge IC substrate PCB delivers superior electrical performance, thermal management, and mechanical reliability. Designed to meet the demands of BGA, CSP, FC, and MCM chip-scale...

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PCB for IC substrate

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

The Full Name and Description of LGA Package: A Revolutionary Step in Semiconductor Packaging Technology This product description explores the evolution, functionality, and future potential of Land Grid Array (LGA) packaging, particularly focusing on the LGA775 variant—a pivotal advancement in CPU interface design....

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Sensor IC Substrate

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

Shengyi SI10U Sensor IC Substrate: High-Performance, Halogen-Free Material for Advanced MEMS Applications The Shengyi SI10U Sensor IC Substrate is a premium printed circuit board material engineered specifically for micro-electro-mechanical systems (MEMS) sensors. Designed to meet the demanding requirements of modern...

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DPC ceramic substrate PCB

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

DPC Ceramic Substrate for High-Performance LED Applications – Advanced Thermal Management & Durability Engineered for precision and reliability, this DPC ceramic substrate leverages advanced ceramic aluminum oxide technology to deliver superior thermal conductivity, mechanical strength, and electrical insulation....

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PCB for IC package substrate

• Brand: UGPCBA
• Min. Order: 1 Piece/Pieces
• Place of Origin: China
• Transportation: Air,Express

IC Package Substrate Solutions for Advanced Semiconductor Applications – Precision, Innovation, and Integration Overview The evolution of semiconductor packaging has driven the demand for high-performance, miniaturized, and reliable IC package substrates. As traditional lead-frame-based solutions reach their limits in...

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